TY - JOUR
T1 - The Development of Pad-Dry-Cure Compatible Method for Preparing Electrically Conductive Copper Coated Cotton Woven Fabrics
JO - Journal of Fiber Bioengineering and Informatics
VL - 2
SP - 117
EP - 128
PY - 2013
DA - 2013/06
SN - 6
DO - http://doi.org/10.3993/jfbi06201301
UR - https://global-sci.org/intro/article_detail/jfbi/4827.html
KW - Electronic Textiles
KW - Pad-dry-cure
KW - Polymer Brushes
KW - Electroless Deposition
KW - Cotton
AB - Electrically conductive cotton fabrics were successfully prepared by a first free radical polymerization,
assisted by a conventional pad-dry-cure textile technology and subsequent electroless deposition (ELD)
of copper thin layers on cotton fiber surfaces. Pad-dry-cure takes a major role in the even uptake
and penetration of the monomer [2-(methacryloyloxy)ethyl]trimethyl-ammonium chloride (METAC)
solution throughout the cotton fabrics, making subsequent ELD plating of copper metal uniform. The
surface electrical resistivity of as-prepared electro-conductive cotton fabrics varies from 10^3 to 10^{-1}Ω/sq,
depending on the ELD conditions. The whole process is low cost, low chemical wastage and compatible
with current wet processing in the textile industry, which provides a great potential in commercialization
in a bulk scale.