TY - JOUR
T1 - Finite Element Analysis of Semiconductor Device Equations with Heat Effect
AU - Jiansong Zhang, Jiang Zhu, Danping Yang & Xijun 
JO - International Journal of Numerical Analysis Modeling Series B
VL - 2
SP - 197
EP - 216
PY - 2010
DA - 2010/01
SN - 1
DO - http://doi.org/
UR - https://global-sci.org/intro/article_detail/ijnamb/332.html
KW - Semiconductor device with heat effect
KW - finite element scheme
KW - existence and uniqueness
KW - convergence analysis
AB - In this paper, the system of the semiconductor device equations with heat effect is considered. An approximation to the system that makes use of a mixed finite element method
for the electrostatic potential equation combined with a finite element method for the densities
equations and the temperature equation is proposed. Existence and uniqueness of the approximate
solution are proved. A convergence analysis is also given.